JPH079415Y2 - 混成集積回路部品 - Google Patents
混成集積回路部品Info
- Publication number
- JPH079415Y2 JPH079415Y2 JP1989004089U JP408989U JPH079415Y2 JP H079415 Y2 JPH079415 Y2 JP H079415Y2 JP 1989004089 U JP1989004089 U JP 1989004089U JP 408989 U JP408989 U JP 408989U JP H079415 Y2 JPH079415 Y2 JP H079415Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- substrate
- integrated circuit
- hybrid integrated
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 56
- 210000000078 claw Anatomy 0.000 claims description 20
- 239000004020 conductor Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989004089U JPH079415Y2 (ja) | 1989-01-18 | 1989-01-18 | 混成集積回路部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989004089U JPH079415Y2 (ja) | 1989-01-18 | 1989-01-18 | 混成集積回路部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0295276U JPH0295276U (en]) | 1990-07-30 |
JPH079415Y2 true JPH079415Y2 (ja) | 1995-03-06 |
Family
ID=31507853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989004089U Expired - Lifetime JPH079415Y2 (ja) | 1989-01-18 | 1989-01-18 | 混成集積回路部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH079415Y2 (en]) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6298271U (en]) * | 1985-12-10 | 1987-06-23 | ||
JPH039345Y2 (en]) * | 1986-02-06 | 1991-03-08 | ||
JPS6398191A (ja) * | 1986-10-15 | 1988-04-28 | 松下電工株式会社 | プリント基板の回路封止構造 |
-
1989
- 1989-01-18 JP JP1989004089U patent/JPH079415Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0295276U (en]) | 1990-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |